Coders & Pixels

Ai Accelerators

2 articles

Editorial illustration for HBM and FOWLP in AI Accelerators: Two Different Answers to the Bandwidth and Thermal Problem
Hardware & Gadgets

HBM and FOWLP in AI Accelerators: Two Different Answers to the Bandwidth and Thermal Problem

HBM provides essential memory bandwidth for AI accelerators through 3D stacking, whereas FOWLP offers a cost-effective, compact integration platform for heterogeneous dies. The choice between them depends on whether raw bandwidth or cost, form factor, and I/O flexibility is the dominant design constraint.

Kaleo Kekoa·October 19, 2026
Editorial illustration for How 3D Stacking and Chiplets Drive Performance in HPC and AI Accelerators
Hardware & Gadgets

How 3D Stacking and Chiplets Drive Performance in HPC and AI Accelerators

Advanced packaging technologies like 3D stacking and chiplets are critical for enhancing performance scaling and heterogeneous integration in modern HPC and AI accelerators. These innovations address limitations of traditional 2D scaling by enabling denser integration, higher bandwidth, and improved power efficiency.

Kaleo Kekoa·September 28, 2026